Press Release

November 3, 2011 at 11:26 AM EDT
Micron Debuts Industry's Broadest Portfolio for Load Reduction Modules, Boosting DRAM Performance and Memory Capacity for Enterprise Server Applications

BOISE, Idaho, Nov. 3, 2011 (GLOBE NEWSWIRE) -- Micron Technology, Inc., today announced a new portfolio of load reduced dual-inline memory modules (LRDIMMs) featuring a 64GB offering. In addition to the standard densities of 8GB, 16GB and 32GB, which are sampling in high volume to several customers, Micron is introducing a 64GB LRDIMM to meet the ever-growing density requirements of servers.

Micron continues its memory market leadership with modules that provide 50 percent higher memory capacity and a performance increase of 33 percent for server applications. Resulting improvements to system scalability can significantly enhance cloud computing, high-performance computing, Web servers, transactional databases, and data analytics while reducing power needs by nearly 10 percent per DIMM slot compared to standard modules.

The loading profile of previous registered DIMMs (RDIMMs) was constrained in the amount of available memory for virtual computing environments. LRDIMMs reduce the load on the server memory bus and enable higher data frequencies and memory capacity.

"LRDIMM technology will change how DRAM is utilized in servers by enabling datacenters to support significantly more memory-intensive applications with the same number of CPUs," said Robert Feurle, Vice President of DRAM Marketing for Micron's DRAM Solutions Group.

LRDIMMs, coupled with appropriate server virtualization strategies, will maximize infrastructure and optimizes return on investment. For example, utilizing Inphi's Isolation Memory Buffer (iMB™) chip in place of a register, Micron's LRDIMMs reduce current DDR3 server module loads 2X for a dual-rank module and 4X for a quad-rank module. 

"With leading companies like Micron, it's exciting to see LRDIMMs become a reality," said Paul Washkewicz, Vice President of Marketing, Computing and Storage at Inphi Corporation. "For the past two years, we worked with Micron, one of our key partners, in the development of their LRDIMMs using our Isolation Memory Buffer (iMB™) technology. Our collaborative effort has enabled a significant increase in memory capacity and performance for DDR3 server systems, which datacenters are anxious to employ."

As new platforms are developed to expand scalability and virtualization of server networks, applications will rely increasingly on the competitive edge provided by Micron's LRDIMM portfolio. Supermicro® SuperServer® solutions are one of the first platforms to support our LRDIMM product line.

"Supermicro leads the market with our application-optimized, high-efficiency server solutions. Incorporating Micron's advanced LRDIMM technology extends our advantages with additional high-capacity, high-performance memory options," said Wally Liaw, Supermicro's Vice President of Sales, International. "Supermicro's LRDIMM-enhanced SuperServer solutions provide our customers with higher memory density, speed and performance for a cost-efficient, competitive business edge."

Samples of Micron's new LRDIMMs are available in 8GB, 16GB, and 32GB capacities, with 64GB modules expected to be available in February 2012. For more details on Micron's family of LRDIMMs, visit

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About Micron

Micron Technology, Inc., is one of the world's leading providers of advanced semiconductor solutions. Through its worldwide operations, Micron manufactures and markets a full range of SSDs, DRAM, NAND and NOR flash memory, as well as other innovative memory technologies, packaging solutions and semiconductor systems for use in leading-edge computing, consumer, networking, embedded and mobile products. Micron's common stock is traded on the NASDAQ under the MU symbol. To learn more about Micron Technology, Inc., visit

©2011 Micron Technology, Inc. All rights reserved. Information is subject to change without notice.  Micron and the Micron orbit logo are trademarks of Micron Technology, Inc. All other trademarks are the property of their respective owners.

CONTACT:  Scott StevensMicron Technology, Inc.


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Source: Micron Technology, Inc.



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